Power chips are connected to outside circuits with packaging, and their efficiency depends on the assistance of the product packaging. In high-power situations, power chips are typically packaged as power modules. Chip interconnection refers to the electrical link on the top surface of the chip, which is typically aluminum bonding wire in typical modules. ^
Traditional power module package cross-section
Today, business silicon carbide power modules still mostly use the product packaging technology of this wire-bonded typical silicon IGBT component. They face problems such as huge high-frequency parasitical parameters, inadequate heat dissipation capacity, low-temperature resistance, and inadequate insulation stamina, which limit making use of silicon carbide semiconductors. The display of excellent efficiency. In order to address these troubles and completely make use of the massive possible benefits of silicon carbide chips, several new product packaging innovations and solutions for silicon carbide power modules have arised in the last few years.
Silicon carbide power module bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have developed from gold cable bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually established from gold cords to copper wires, and the driving pressure is expense reduction; high-power gadgets have actually created from aluminum cords (strips) to Cu Clips, and the driving pressure is to improve product efficiency. The higher the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a strong copper bridge soldered to solder to link chips and pins. Compared with standard bonding packaging techniques, Cu Clip technology has the adhering to advantages:
1. The link between the chip and the pins is constructed from copper sheets, which, to a specific degree, replaces the typical cable bonding technique between the chip and the pins. Therefore, a distinct package resistance value, greater existing flow, and better thermal conductivity can be gotten.
2. The lead pin welding area does not need to be silver-plated, which can totally save the price of silver plating and inadequate silver plating.
3. The product look is totally constant with regular items and is mainly utilized in web servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power materials, and other areas.
Cu Clip has 2 bonding approaches.
All copper sheet bonding approach
Both eviction pad and the Source pad are clip-based. This bonding technique is a lot more costly and complicated, however it can accomplish better Rdson and far better thermal impacts.
( copper strip)
Copper sheet plus cord bonding method
The source pad uses a Clip method, and eviction uses a Cord technique. This bonding technique is slightly less expensive than the all-copper bonding method, conserving wafer location (relevant to really tiny gate locations). The procedure is less complex than the all-copper bonding approach and can acquire far better Rdson and better thermal result.
Distributor of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper wire price, please feel free to contact us and send an inquiry.
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